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ANAEROBICS CYANOACRYLATES POLYSULFIDES URETHANES/POLYURETHANES SILICONES SPECIALTY

General Purpose
Potting/Encapsulation Compounds
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Potting/Encapsulation Compounds

INSTAbond® 803 (MSDS) (Technical Data Bulletin)

INSTAbond® 803 -- A low viscosity two-component general purpose electrical encapsulant/molding compound that is designed for applications requiring high-impact strength, thermal shock resistance, good corrosion resistance, and good water resistance. INSTAbond® 803 is suitable for service temperature in the range of -50 to +120 degrees C.

INSTAbond® 806 (MSDS) (Technical Data Bulletin)

INSTAbond® 806 -- A two-component low-viscosity epoxy that is designed for general potting and encapsulation.

INSTAbond® 807 (MSDS) (Technical Data Bulletin)

INSTAbond® 807 -- An epoxy electrical encapsulant that meets V-0 flammability rating and has excellent electrical properties. INSTAbond 807 exhibits low shrinkage and low thermal expansion to maximize adhesion and reduce mechanical stress on potted parts.

INSTAbond® 808A (MSDS) (Technical Data Bulletin)

INSTAbond® 808A -- A two-component general purpose potting compound for electrical components. Properties include enhancement of mecahnical strength, low dielectrics, vibration and shock resistance of assembled components.

INSTAbond® 808 (MSDS) (Technical Data Bulletin)

INSTAbond® 808 -- A general purpose epoxy encapsulant that features good electrical and mechanical properties. INSTAbond® 808 contains a soft filler that reduces abrasionin automated dispensing systems, and improves machinability of the cured compound.

INSTAbond® 808LV (MSDS) (Technical Data Bulletin)

INSTAbond® 808LV -- A general purpose epoxy encapsulant that features good electrical and mechanical properties for applications requiring low viscosity or higher flow properties. INSTAbond® 808LV contains a soft filler that reduces abrasion in automated dispensing systems, and improves machinability of the cured compound.

INSTAbond® 809 FRCE (MSDS) (Technical Data Bulletin)

INSTAbond® 809 FRCE -- Is a two-component epoxy potting compound that is designed for large mass encapsulation. It features high thermal conductivity, low viscosity, long pot life and low exotherm. INSTAbond® 809 FRCE also meets UL-94 V-0 rating for flame retardancy.

INSTAbond® 826 (MSDS) (Technical Data Bulletin)

INSTAbond® 826 -- Is a low viscosity, two-component epoxy compound that cures at room temperature. It features high flexibilty, high impact resistance, thermal shock, water/chemical resistance, and good mechanical properties. The wicking and air release capabilities of INSTAbond® 826 make it ideal for molding applications having intricate shapes or tightly packed coils and components.

INSTAbond® 838 (MSDS) (Technical Data Bulletin)

INSTAbond® 838 -- Is a low viscosity, two-component epoxy compound designed for general purpose molding applications. The flow properties of INSTAbond® 838 make it ideal for applications requiring high penetration and filling of very small voids. Other benefits include positive cure under damp cool conditions, good flexibilty and good environmental resistance.

 

   

 


       
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